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Shenzhen Hengda Electronics Co.,Ltd

Showing 1 - 3 of 3, total 1 pages        [First] [Previous] [Next] [Last]

1
pcb assembly contract manufacturer
pcb assembly contract manufacturer
Specification: 1-24 layer
Detail: 1 Layer 1-30 layer 2 Material FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum 3 Board thickness 0.2mm-7mm 4 Max.finished board side 500mm*500mm 5 Min.drilled hole size 0.2mm 6 Min.line width 0.075mm(3mil) 7...

2
pcb assembly contract manufacturer
pcb assembly contract manufacturer
Specification: 1-24 layer
Detail: 1 Layer 1-30 layer 2 Material FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum 3 Board thickness 0.2mm-7mm 4 Max.finished board side 500mm*500mm 5 Min.drilled hole size 0.2mm 6 Min.line width 0.075mm(3mil) 7...

3
pcb manufacturer with assembly service
pcb manufacturer with assembly service
Specification: 1-24 layer
Detail: 1 Layer 1-30 layer 2 Material FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum 3 Board thickness 0.2mm-7mm 4 Max.finished board side 500mm*500mm 5 Min.drilled hole size 0.2mm 6 Min.line width 0.075mm(3mil) 7...
Showing 1 - 3 of 3, total 1 pages        [First] [Previous] [Next] [Last]
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